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ZH 1.5mm 1*5P 90°DIP KINK PIN Wafer Wire To Board Connector PA66 30%GF UL94V-0 Sn Plated
Rating Current | 1.0AMP |
Rated Voltage | 50V AC/DC |
Contact Resistance | 20mΩ Max |
Withstand Voltage | 500V AC/Minute |
Insulation Resistance | 500mΩ Min |
Operation Temperature | -25℃ to +85℃ |
Contact Plating | Brass |
Insulator Material | PA66+30%GF(UL94V-0) |
Product Name: Wafer connector | ||
1. features: it makes the production process more convenient, more flexible design, reduces the | ||
production and maintenance cost, easy repair, and easy to upgrade, improve the flexibility of design | ||
2. material: (UL94V-0) PA9T, PA6T, PA46, PA66 etc. | ||
3. scope of application: used in computer and peripheral equipment, communication products, test instruments, consumer electronics products, automotive industry, medical and electronic products production, military and aerospace industry in which the device connecting the two active devices, current or signal transmission. |
Drawing:Wafer WF1501-WRXXX01.pdf