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1.5mm 02~20P White Wafer Wire To Board Connector Housing 1.0AMP
Current Rating | 1.0AMP |
Contact Resistance | 20mΩ Max |
Withstand Voltage | 800V AC/Minute |
Insulation Resistance | 1000mΩ Min |
Operation Temperature | -25℃ to +85℃ |
Contact Material | Phosphor Bronze |
Contact Plating | Au Or Sn Over Ni |
Insulator Material | PA66+30%GF UL94V-0 |
Product Name: Wafer connector
1. Wire To Board Connector features: it makes the production process more convenient, more flexible design, reduces the
production and maintenance cost, easy repair, and easy to upgrade, improve the flexibility of design
2. Wire To Board Connector material: (UL94V-0) PA9T, PA6T, PA46, PA66 etc.
3. Scope of application: used in computer and peripheral equipment, communication products, test instruments, consumer electronics products, automotive industry, medical and electronic products production, military and aerospace industry in which the device connecting the two active devices, current or signal transmission.