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1.25mm 1*6P Wafer Wire To Board Connector Housing 1.0AMP 180°DIP
Rated Voltage | 100V AC/DC |
Rated Current | 1.0AMP |
Contact Resistance | 20mΩ Max |
Withstand Voltage | 500V AC/DC |
Insulation Resistance | 100mΩ Min |
Operation Temperature | -25℃ to +85℃ |
Contact Material | Brass |
Contact Plating | Au Or Sn Over Ni |
Insulator Material | PA6T+30%GF UL94V-0 |
Product Name: Wafer connector | ||
1. features: it makes the production process more convenient, more flexible design, reduces the | ||
production and maintenance cost, easy repair, and easy to upgrade, improve the flexibility of design | ||
2. material: (UL94V-0) PA9T, PA6T, PA46, PA66 etc. | ||
3. scope of application: used in computer and peripheral equipment, communication products, test instruments, consumer electronics products, automotive industry, medical and electronic products production, military and aerospace industry in which the device connecting the two active devices, current or signal transmission. |